Bond Force Testers

Suitable for testing the strength of microelectronic after bonding, and adhesion testing between solder and substrate surfaces, and failure analysis

Suitable for wire pull, bond shear, ball shear, die shear test

The corresponding test module can be replaced according to the need, and the system automatically identifies the module parameter information

With landing protection function to prevent damage to the test probe by misoperation

The equipment adopts air suspension bearings, which provide extremely low touchdown force and won't damage the substrate